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High Density Interconnect(HDI) PCB Fabrication

What are High Density Interconnector (HDI) Printed Circuit Board (PCBs)? What are the current limits of Bittele Electronics’ HDI PCB fabrication capability? What new capabilities are planned in the future?

We at Bittele Electronics have improved and upgraded our manufacturing facilities in 2016 to include HDI board fabrication and assembly. We now provide manufacturing High Density Interconnect(HDI) PCB service in our comprehensive list of PCB fabrication and assembly capabilities.

HDI or High Density Interconnector is a new technology often used in multi-layer Printed Circuit Board (PCB) design. HDI PCBs are printed circuit boards(PCB) on a substrate with a much higher wiring density per unit area and pad connection density than a traditional PCB. Characteristics of HDI PCBs are that they have finer lines, closer spaces, smaller capture pads, micro- via and higher connection pad density than conventional PCB technology. Using HDI instead of conventional PCBs can reduce the thickness size and weight as well as to enhance electrical performance of the PCB. This is due to the micro-via and buried via in the HDI PCB sequentially laminated using various insulation materials and conductor wiring for higher density of routing.

Currently the electronic market trend is the increase in demand for more lightweight and thinner PCBs that can handle high-speed signals with reduced signal loss. This trend fuels a growing market for smaller HDI PCB manufacturing as consumer electronic end-products are produced in smaller form factors. Due to the increasing market demand for HDI PCB manufacturing, we at Bittele Electronics have served clients from more and more different industries, including:

  1. Automotive (Engine Control Units, GPS, Dashboard Electronics)
  2. Computers (Laptops, Tablets, Wearable Electronics, Internet of Things - IoT)
  3. Communication (Mobile phones, Modules, Routers, Switches)
  4. Digital (Cameras, Audio, Video)

Bittele Electronics offers many HDI fabrication options such as back drilling, controlled depth drilling, and Press Fit holes (tight hole tolerance). We also offer 1/4 oz. and 3/8 oz. copper foils as well cores (laminates) as thin as 0.001" like shown below for HDI fabrication. Notably Bittele offers HDI technologies like Buried Capacitance (BC) Cores as well as dual FINISH, multiple color solder mask & silk screen, short gold fingers, hybrid builds, etc.

Currently Bittele Electronics’ PCB manufacturing facilities in China have been upgraded to be able to manufacture HDI PCB with the capability to fabricate the following:

  1. Buried, Blind and Micro-Via
  2. NCVF
  3. Copper Fill
  4. Sequential Lamination
  5. 3/3 Traces/Space
  6. 5% Impedance

Currently Bittele Electronics can fabricate a sequentially laminated HDI board with up to 40 layers. Also our newly installed most advanced Laser Drill Machines are now capable of laser drilling holes as small as 0.002 inch. Bittele Electronics can fabricate HDI PCBs with inner and outer layers of 3/3 Trace/Space. Regarding HDI PCB fabrication we offer a large variety of raw PCB laminate materials, including some from North America & various exotic materials. For the full list of our HDI PCB fabrication capabilities please refer to the technology roadmap below:


Bittele HDI Technology Matrix
Laser Drill0.002"
Copper Pad0.008"
Micro ViaMax. 8
Smallest BGA0.40 mm
Trace/Space0.003"/0.003"
Impedance5%

We at Bittele Electronics are committed to the goal of further improving and refining the HDI PCB manufacturing services we offer. Currently our facility improvement goal for 2017 is to add capabilities such as processing Panasonic’s Megtron 4 and 6 as laminate materials, less than 5% impedance testing, wire bonding, and less than 0.003" Trace/Space. For more details, our manufacturing facilities HDI technologies please contact us for more details.

 
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