Bittele Electronics has a vast amount of expertise in Ball Grid Array Assembly (BGA). Our facilities house the most current BGA placement equipment as well as X-ray inspection equipment. We have developed over the years BGA assembly processes with a proven record of producing BGA circuit boards with excellent yield rates and the highest quality in the electronics manufacturing industry.
Our BGA assembly equipment can process the following types of BGA applications:
- Size: micro BGAs (2mmX3mm) to large size BGAs (45 mm)
- Materials: ceramics and plastics
- Pitch: 0.4 mm (minimum)
Optimizing the Thermal Profiles
To ensure the highest quality of our BGA assembly processes, Bittele’s production staff begins the process by optimizing the thermal profile as a preliminary yet critical step in the assembly process. They analyze in a detail manner your PCB files, BGA data sheets, BGA size and ball material composition (leaded or lead-free). For large BGA sizes, the thermal profile is optimized by localizing internal BGA heating to prevent a void. Using IPC Class II inspection standards we ensure the void is below 25 percent of the total solder-ball diameter. Lead-free BGA applications undergo a specialized lead-free thermal profile to avoid open ball problems commonly caused by lower temperatures. Conversely, leaded BGA applications undergo a specialized leaded process that prevents higher temperatures from causing pin shorts.
Upon receipt of your turnkey PCB assembly order, your PCB design will be reviewed for both BGA and Design for Manufacturing (DFM) assembly, which includes examining your requirements for circuit board material, surface finish, maximum warpage, and solder mask clearance.
Evaluations for BGA soldering, BGA Rework and Reballing
Bittele Electronics offers a BGA soldering service for the testing and evaluation of BGA rework or reballing tasks. This service is also used when a client needs a small amount of BGAs or fine pitch parts assembled on prototype PCBs.
To perform BGA rework, we perform the following tasks:
- Remove components
- Prepare the site
- Apply solder paste
- Replace BGA
- Perform the reflow process
Bittele’s BGA rework is guaranteed that no damage will occur on the reworked PCBs.
To discover soldering defects, such as paste bridging and insufficient ball melting, as a result of the BGA assembly processes, X-ray inspection equipment is commonly used to localize the source of the problem. Bittele’s technicians utilize X-ray analysis software to calculate the solder ball’s gap size to ensure it is within range of the IPC Class II standard. They also perform 2-D x-ray tests to obtain 3-D images to verify problems including, broken vias on the PCB’s inner layers or cold solder joints of BGA balls.
Inquiries and Quotes
To obtain a quote for a future BGA assembly order, including rework, reballing or soldering, please send your request to email@example.com