bga soldering
 
 
In This Section
PCB Design & Layout
PCB Fabrication
PCB Assembly
PCB Assembly Services
PCB Assembly FAQ
PCB Assembly Quote
Prototype PCB Assembly
Low Volume PCB Assembly
BGA Assembly
SMT Assembly
Quick-turn PCB Assembly
PCB Assembly Components
You Are Here:Services >> PCB Assembly >> BGA Assembly
BGA Assembly

Bittele Electronics has a vast amount of expertise in Ball Grid Array Assembly (BGA). Our facilities house the most current BGA placement equipment as well as X-ray inspection equipment. We have developed over the years BGA assembly processes with a proven record of producing BGA circuit boards with excellent yield rates and the highest quality in the electronics manufacturing industry.

Our BGA assembly equipment can process the following types of BGA applications:

  1. Size: micro BGAs (2mmX3mm) to large size BGAs (45 mm)
  2. Materials: ceramics and plastics
  3. Pitch: 0.4 mm (minimum)

Optimizing the Thermal Profiles

To ensure the highest quality of our BGA assembly processes, Bittele’s production staff begins the process by optimizing the thermal profile as a preliminary yet critical step in the assembly process. They analyze in a detail manner your PCB files, BGA data sheets, BGA size and ball material composition (leaded or lead-free). For large BGA sizes, the thermal profile is optimized by localizing internal BGA heating to prevent a void. Using IPC Class II inspection standards we ensure the void is below 25 percent of the total solder-ball diameter. Lead-free BGA applications undergo a specialized lead-free thermal profile to avoid open ball problems commonly caused by lower temperatures. Conversely, leaded BGA applications undergo a specialized leaded process that prevents higher temperatures from causing pin shorts.

Upon receipt of your turnkey PCB assembly order, your PCB design will be reviewed for both BGA and Design for Manufacturing (DFM) assembly, which includes examining your requirements for circuit board material, surface finish, maximum warpage, and solder mask clearance.

Evaluations for BGA soldering, BGA Rework and Reballing

Bittele Electronics offers a BGA soldering service for the testing and evaluation of BGA rework or reballing tasks. This service is also used when a client needs a small amount of BGAs or fine pitch parts assembled on prototype PCBs.

To perform BGA rework, we perform the following tasks:

  1. Remove components
  2. Prepare the site
  3. Apply solder paste
  4. Replace BGA
  5. Perform the reflow process

Bittele’s BGA rework is guaranteed that no damage will occur on the reworked PCBs.

X-Ray Inspections

To discover soldering defects, such as paste bridging and insufficient ball melting, as a result of the BGA assembly processes, X-ray inspection equipment is commonly used to localize the source of the problem. Bittele’s technicians utilize X-ray analysis software to calculate the solder ball’s gap size to ensure it is within range of the IPC Class II standard. They also perform 2-D x-ray tests to obtain 3-D images to verify problems including, broken vias on the PCB’s inner layers or cold solder joints of BGA balls.

Inquiries and Quotes

To obtain a quote for a future BGA assembly order, including rework, reballing or soldering, please send your request to sales@7pcb.com
right top
 
Bittele installs new pcb assembly production line
Bittele supports Waterloo engineering students
Bittele strategy climbs turnkey PCB assembly ladder
Bittele Electronics Sponsors Georgia Tech’s Solar Car Engineering Team
 
Sample Bill of Materials (BOM)
Standard Multi-layer PCB Stack-up
PCB Fabrication Specifications
 
testimonials
 
payment types
 
PCB Assembly cost calculator PCB quote calculator Free prototype  Receive 10% off
 
 
About Bittele | Services | FAQ | Request for Quote | Privacy | Contact Us
Copyright 2003-2015, Bittele Electronics Inc. All Rights Reserved.